Since 1969, Sensitron Semiconductor has been a manufacturer of discrete semiconductors and microelectronics for aerospace, defense, medical, and other high reliability markets, and applications. Our long-term success can be attributed to the talent, creativity, and dedication of our employees. Sensitron strives to create an environment in which all employees can reach their full potential and recognize their contribution to the growth of our company. Your journey to success starts here!

Candidate will work in a cleanroom environment, wearing cleanroom coat and hairnet and mask. Candidate will run automatic and/or manual bonding machines that bonds gold and /or aluminum wires to microelectronic integrated circuits; connecting IC's to circuitry then to package leads.

Responsibilities:

Responsible for becoming familiar with the operation of all the wire bonding equipment in the Wire bond / Assembly area, as well as understanding the manufacturing processes.
Maintain proper documentation on job travelers, logs, and bills of materials.
Read and understand information contained on job travelers and layout drawings to assure that all requirements or special instructions applicable to the wire bonding processes or other assigned processes are met.
Daily work assignments may also include assemble, rework and/or test electronic components following prescribed processes and assembly procedures using a variety of hand tools and equipment. Set up work as required, as well as movement of material. Work from drawings, schematics, and written instructions to affect mechanical assembly.
Candidate will conduct quality inspections on processing line in accordance with quality specifications; adhere to all quality and safety guidelines.

Requirements:

2+ years of manual wire bonding experience -Aluminum experience preferred
Able to read complex assembly drawings to determine sequence of operation
Have experience and comfortable working with computers
Good communication skills
Strong attention to detail
Ability to work well in a fast-paced environment
Good manual dexterity for handling precise small fragile components under a microscope using tweezers and probes.
Working knowledge and the use of low- and high-powered microscopes for wire bonding.

Experience

Ability to assemble integrated microcircuits to the following standards:
*MIL-PRF-38535
*MIL-PRF-19500
*MIL-STD-750
*MIL-STD-883
Experience in the proper setup and operations of the following machines without assistance, is a plus:
F&K, K&S, Orthodyne, or similar small diameter wire bonding equipment.

* This position requires access to technology, material, software or hardware that is controlled by export laws of the US. In order to be eligible, you must be either a US citizen or permanent resident.

* Sensitron is an equal opportunity employer offering an attractive medical/dental and 401k benefits package.
* Veterans are encouraged to apply.

The salary range and/or hourly rate listed is a good faith determination of potential base compensation that may be offered to a successful applicant for this position at the time of this job advertisement and may be modified in the future. When determining a team member's base salary and/or rate, several factors may be considered as applicable (e.g., location, specialty, service line, years of relevant experience, education, credentials, budget and internal equity).

Hybrid Wire Bonder / Micro Assembler at Sensitron Semiconductor

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