Physical Design Engineer at P Chappel Associates Inc

We're looking for a hands-on Physical Design Engineer to support complex SoC projects for our client who designs and delivers advanced System-on-Chip solutions across AR/VR, imaging, networking, and storage technologies. They provide high-performance custom solutions for cutting-edge applications. You'll collaborate with customers, frontend, and integration teams to ensure successful tape-outs, contributing across all phases of physical design. Key Responsibilities: Pre-layout STA for feasibility and timing constraint validation Chip/block-level floorplanning and pin assignment Clock spec review and clock tree synthesis Placement, routing, and timing optimization Sign-off tasks: RC extraction, STA, IR-drop analysis, and physical verification Customer meetings and technical presentations Qualifications: BSEE with 5+ years experience; MSEE preferred Strong experience in ASIC physical design and SoC development (28nm/16nm) Proficient in ICC2/Innovus, scripting (Perl/Tcl/Python) Knowledge of frontend design and hierarchical layouts Familiar with power/IR-drop tools (PrimePower/Redhawk) and STA (PrimeTime) Skilled in PV tools and debugging PV errors Excellent communication and problem-solving skills